Thermal interface materials bridge the microscopic air gaps between cells, modules and cooling plates. The family covers soft thermal pads, thin TIM films, coated and reinforced layers, plus compression and cushion pads where tolerance take-up is required.

Typical formats

• Thermal pads
• TIM films
• Coated TIM layers
• Compression / cushion pads

Application support

Material selection is reviewed against position, function, substrate, process and validation target. Samples and die-cut prototypes are available for evaluation.