Thermal Interface Pads & TIM Films
Pads, films, TIM layers and compression/cushion pads for module-to-cooling and cell interfaces.
View DetailsThermal interface materials bridge the microscopic air gaps between cells, modules and cooling plates. The family covers soft thermal pads, thin TIM films, coated and reinforced layers, plus compression and cushion pads where tolerance take-up is required.
Pads, films, TIM layers and compression/cushion pads for module-to-cooling and cell interfaces.
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