Potting compounds, encapsulants and conformal coatings protect BMS boards, sensing assemblies and power electronics from moisture, vibration and dielectric stress. They are selected by cure mechanism, thermal conductivity and rework requirements.

Typical formats

• Potting compounds
• Encapsulants
• Conformal coatings
• Thermally conductive potting

Application support

Material selection is reviewed against position, function, substrate, process and validation target. Samples and die-cut prototypes are available for evaluation.